View CD74ACT273SM96_9040054.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

1 data sheet acquired from harris semiconductor schs249b features buffered inputs typical propagation delay - 6.5ns at v cc = 5v, t a = 25 o c, c l = 50pf exceeds 2kv esd protection mil-std-883, method 3015 scr-latchup-resistant cmos process and circuit design speed of bipolar fast/as/s with signi?antly reduced power consumption balanced propagation delays ac types feature 1.5v to 5.5v operation and balanced noise immunity at 30% of the supply 24ma output drive current - fanout to 15 fast ics - drives 50 ? transmission lines pinout cd54ac273, cd54act273 (cdip) cd74ac273, cd74act273 (pdip, soic) top view description the ?c273 and ?ct273 devices are octal d-type ?p-?ps with reset that utilize advanced cmos logic technology. information at the d input is transferred to the q output on the positive-going edge of the clock pulse. all eight ?p-?ps are controlled by a common clock (cp) and a common reset ( mr). resetting is accomplished by a low voltage level independent of the clock. 11 12 13 14 15 16 17 18 20 19 10 9 8 7 6 5 4 3 2 1 mr q0 d0 d1 q1 q2 d3 d2 q3 gnd v cc d7 d6 q6 q7 q5 d5 d4 q4 cp ordering information part number temperature range package cd74ac273e 0 o c to 70 o c -40 o c to 85 o c -55 o c to 125 o c 20 ld pdip cd54ac273f3a -55 o c to 125 o c 20 ld cdip cd74act273e 0 o c to 70 o c -40 o c to 85 o c -55 o c to 125 o c 20 ld pdip cd54act273f3a -55 o c to 125 o c 20 ld cdip cd74ac273m 0 o c to 70 o c -40 o c to 85 o c -55 o c to 125 o c 20 ld soic cd74act273m 0 o c to 70 o c -40 o c to 85 o c -55 o c to 125 o c 20 ld soic notes: 1. when ordering, use the entire part number. add the suffix 96 to obtain the variant in the tape and reel. 2. wafer and die for this part number is available which meets all electrical specifications. please contact your local sales office for ordering information. august 1998 - revised july 2002 caution: these devices are sensitive to electrostatic discharge. users should follow proper ic handling procedures. fast is a trademark of fairchild semiconductor. copyright 2002, texas instruments incorporated cd54ac273, cd74ac273 cd54act273, cd74act273 octal d flip-flop with reset
2 functional diagram truth table inputs outputs reset ( mr) clock cp data dn qn lxxl h hh h ll hlxq0 h = high level (steady state), l = low level (steady state), x = irrel- evant, = transition from low to high level, q0 = the level of q before the indicated steady-state input conditions were estab- lished. q0 q1 q2 q3 q4 q5 q6 q7 reset mr d0 d1 d2 d3 d4 d5 d6 d7 clock cp data inputs data outputs cd54ac273, cd74ac273, cd54act273, cd74act273
3 absolute maximum ratings thermal information dc supply voltage, v cc . . . . . . . . . . . . . . . . . . . . . . . . -0.5v to 6v dc input diode current, i ik for v i < -0.5v or v i > v cc + 0.5v . . . . . . . . . . . . . . . . . . . . . . 20ma dc output diode current, i ok for v o < -0.5v or v o > v cc + 0.5v . . . . . . . . . . . . . . . . . . . . 50ma dc output source or sink current per output pin, i o for v o > -0.5v or v o < v cc + 0.5v . . . . . . . . . . . . . . . . . . . . 50ma dc v cc or ground current, i cc or i gnd (note 3) . . . . . . . . . 100ma operating conditions temperature range, t a . . . . . . . . . . . . . . . . . . . . . . -55 o c to 125 o c supply voltage range, v cc (note 4) ac types. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.5v to 5.5v act types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5v to 5.5v dc input or output voltage, v i , v o . . . . . . . . . . . . . . . . . 0v to v cc input rise and fall slew rate, dt/dv ac types, 1.5v to 3v . . . . . . . . . . . . . . . . . . . . . . . . . 50ns (max) ac types, 3.6v to 5.5v . . . . . . . . . . . . . . . . . . . . . . . . 20ns (max) act types, 4.5v to 5.5v. . . . . . . . . . . . . . . . . . . . . . . 10ns (max) thermal resistance, ja (typical, note 5) e package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 o c/w m package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 o c/w maximum junction temperature (plastic package) . . . . . . . . . . 150 o c maximum storage temperature range . . . . . . . . . .-65 o c to 150 o c maximum lead temperature (soldering 10s) . . . . . . . . . . . . . 300 o c caution: stresses above those listed in ?bsolute maximum ratings may cause permanent damage to the device. this is a stress only rating and operatio n of the device at these or any other conditions above those indicated in the operational sections of this speci?ation is not im plied. notes: 3. for up to 4 outputs per device, add 25ma for each additional output. 4. unless otherwise specified, all voltages are referenced to ground. 5. the package thermal impedance is calculated in accordance with jesd 51. dc electrical speci?ations parameter symbol test conditions v cc (v) 25 o c -40 o c to 85 o c -55 o c to 125 o c units v i (v) i o (ma) min max min max min max ac types high level input voltage v ih - - 1.5 1.2 - 1.2 - 1.2 - v 3 2.1 - 2.1 - 2.1 - v 5.5 3.85 - 3.85 - 3.85 - v low level input voltage v il - - 1.5 - 0.3 - 0.3 - 0.3 v 3 - 0.9 - 0.9 - 0.9 v 5.5 - 1.65 - 1.65 - 1.65 v high level output voltage v oh v ih or v il -0.05 1.5 1.4 - 1.4 - 1.4 - v -0.05 3 2.9 - 2.9 - 2.9 - v -0.05 4.5 4.4 - 4.4 - 4.4 - v -4 3 2.58 - 2.48 - 2.4 - v -24 4.5 3.94 - 3.8 - 3.7 - v -75 (note 6, 7) 5.5 - - 3.85 - - - v -50 (note 6, 7) 5.5---- 3.85 - v cd54ac273, cd74ac273, cd54act273, cd74act273
4 low level output voltage v ol v ih or v il 0.05 1.5 - 0.1 - 0.1 - 0.1 v 0.05 3 - 0.1 - 0.1 - 0.1 v 0.05 4.5 - 0.1 - 0.1 - 0.1 v 12 3 - 0.36 - 0.44 - 0.5 v 24 4.5 - 0.36 - 0.44 - 0.5 v 75 (note 6, 7) 5.5 - - - 1.65 - - v 50 (note 6, 7) 5.5----- 1.65 v input leakage current i i v cc or gnd - 5.5 - 0.1 - 1- 1 a quiescent supply current msi i cc v cc or gnd 0 5.5 - 8 - 80 - 160 a act types high level input voltage v ih - - 4.5 to 5.5 2-2-2- v low level input voltage v il - - 4.5 to 5.5 - 0.8 - 0.8 - 0.8 v high level output voltage v oh v ih or v il -0.05 4.5 4.4 - 4.4 - 4.4 - v -24 4.5 3.94 - 3.8 - 3.7 - v -75 (note 6, 7) 5.5 - - 3.85 - - - v -50 (note 6, 7) 5.5---- 3.85 - v low level output voltage v ol v ih or v il 0.05 4.5 - 0.1 - 0.1 - 0.1 v 24 4.5 - 0.36 - 0.44 - 0.5 v 75 (note 6, 7) 5.5 - - - 1.65 - - v 50 (note 6, 7) 5.5----- 1.65 v input leakage current i i v cc or gnd - 5.5 - 0.1 - 1- 1 a quiescent supply current msi i cc v cc or gnd 0 5.5 - 8 - 80 - 160 a additional supply current per input pin ttl inputs high 1 unit load ? i cc v cc -2.1 - 4.5 to 5.5 - 2.4 - 2.8 - 3 ma notes: 6. test one output at a time for a 1-second maximum duration. measurement is made by forcing current and measuring voltage to minimize power dissipation. 7. test verifies a minimum 50 ? transmission-line-drive capability at 85 o c, 75 ? at 125 o c. act input load table input unit load dn 0.5 mr 0.57 cp 1 note: unit load is ? i cc limit specified in dc electrical specifications table, e.g., 2.4ma max at 25 o c. dc electrical speci?ations (continued) parameter symbol test conditions v cc (v) 25 o c -40 o c to 85 o c -55 o c to 125 o c units v i (v) i o (ma) min max min max min max cd54ac273, cd74ac273, cd54act273, cd74act273
5 prerequisite for switching function parameter symbol v cc (v) -40 o c to 85 o c -55 o c to 125 o c units min max min max ac types data to cp set-up time t su 1.5 2 - 2 - ns 3.3 (note 9) 2-2-ns 5 (note 10) 2-2-ns hold time t h 1.5 2 - 2 - ns 3.3 2 - 2 - ns 52-2-ns removal time, mr to cp t rem 1.5 2 - 2 - ns 3.3 2 - 2 - ns 52-2-ns mr pulse width t w 1.5 55 - 63 - ns 3.3 6.1 - 7 - ns 5 4.4 - 5 - ns cp pulse width t w 1.5 55 - 63 - ns 3.3 6.1 - 7 - ns 5 4.4 - 5 - ns cp frequency f max 1.5 9 - 8 - mhz 3.3 81 - 71 - mhz 5 114 - 100 - mhz act types data to cp set-up time t su 5 (note 10) 2-2-ns hold time t h 52-2-ns removal time mr to cp t rem 52-2-ns mr pulse width t w 5 4.4 - 5 - ns cp pulse width t w 5 5.3 - 6 - ns cp frequency f max 5 97 - 85 - mhz switching speci?ations input t r , t f = 3ns, c l = 50pf (worst case) parameter symbol v cc (v) -40 o c to 85 o c -55 o c to 125 o c units min typ max min typ max ac types propagation delay, cp to qn t plh , t phl 1.5 - - 154 - - 169 ns 3.3 (note 9) 4.9 - 17.2 4.7 - 18.9 ns 5 (note 10) 3.5 - 12.3 3.4 - 13.5 ns cd54ac273, cd74ac273, cd54act273, cd74act273
6 propagation delay, mr to qn t plh , t phl 1.5 - - 154 - - 169 ns 3.3 4.9 - 17.2 4.7 - 18.9 ns 5 3.5 - 12.3 3.4 - 13.5 ns input capacitance c i - - -10- -10pf power dissipation capacitance c pd (note 11) - - 45 - - 45 - pf act types propagation delay, cp to qn t plh , t phl 5 (note 10) 3.5 - 12.3 3.4 - 13.5 ns propagation delay, mr to qn t plh , t phl 5 3.5 - 12.3 3.4 - 13.5 ns input capacitance c i - - -10- -10pf power dissipation capacitance c pd (note 11) - - 45 - - 45 - pf notes: 8. limits tested 100%. 9. 3.3v min is at 3.6v, max is at 3v. 10. 5v min is at 5.5v, max is at 4.5v. 11. c pd is used to determine the dynamic power consumption per flip-flop. ac: p d = c pd v cc 2 f i = (c l v cc 2 f o ) act: p d =c pd v cc 2 f i + (c l v cc 2 f o )+v cc ? i cc where f i = input frequency, f o = output frequency, c l = output load capacitance, v cc = supply voltage. figure 1. propagation delay times and clock pulse width figure 2. prerequisite and propagation delay times for master reset switching speci?ations input t r , t f = 3ns, c l = 50pf (worst case) (continued) parameter symbol v cc (v) -40 o c to 85 o c -55 o c to 125 o c units min typ max min typ max 90% t f t r v s v s v s v s v s t plh t phl t w 10% 10% cp input level q mr cp input level v s q v s t rem v s v s t plh t w gnd input ( q) cd54ac273, cd74ac273, cd54act273, cd74act273
7 figure 3. prerequisite for clock d v s v s v s v s v s v s t h (h) t su (l) t h (l) t su (h) cp output level dut output r l (note) output load 500 ? c l 50pf note: for ac series only: when v cc = 1.5v, r l = 1k ?. figure 4. propagation delay times ac act input level v cc 3v input switching voltage, v s 0.5 v cc 1.5v output switching voltage, v s 0.5 v cc 0.5 v cc cd54ac273, cd74ac273, cd54act273, cd74act273
packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) cd54ac273f3a active cdip j 20 1 tbd a42 snpb n / a for pkg type cd54act273f3a active cdip j 20 1 tbd a42 snpb n / a for pkg type cd74ac273e active pdip n 20 20 pb-free (rohs) cu nipdau n / a for pkg type cd74ac273ee4 active pdip n 20 20 pb-free (rohs) cu nipdau n / a for pkg type cd74ac273m active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74ac273m96 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74ac273m96e4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74ac273me4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74ac273sm obsolete ssop db 20 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74act273e active pdip n 20 20 pb-free (rohs) cu nipdau n / a for pkg type cd74act273ee4 active pdip n 20 20 pb-free (rohs) cu nipdau n / a for pkg type cd74act273m active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74act273m96 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74act273m96e4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74act273me4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74act273pw active tssop pw 20 70 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74act273pwe4 active tssop pw 20 70 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74act273pwr active tssop pw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74act273pwre4 active tssop pw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74act273sm obsolete ssop db 20 green (rohs & no sb/br) cu nipdau level-1-260c-unlim CD74ACT273SM96 active ssop db 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim CD74ACT273SM96e4 active ssop db 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. package option addendum www.ti.com 6-dec-2006 addendum-page 1
(2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. package option addendum www.ti.com 6-dec-2006 addendum-page 2

mechanical data msso002e ? january 1995 ? revised december 2001 post office box 655303 ? dallas, texas 75265 db (r-pdso-g**) plastic small-outline 4040065 /e 12/01 28 pins shown gage plane 8,20 7,40 0,55 0,95 0,25 38 12,90 12,30 28 10,50 24 8,50 seating plane 9,90 7,90 30 10,50 9,90 0,38 5,60 5,00 15 0,22 14 a 28 1 20 16 6,50 6,50 14 0,05 min 5,90 5,90 dim a max a min pins ** 2,00 max 6,90 7,50 0,65 m 0,15 0 ? 8 0,10 0,09 0,25 notes: a. all linear dimensions are in millimeters. b. this drawing is subject to change without notice. c. body dimensions do not include mold flash or protrusion not to exceed 0,15. d. falls within jedec mo-150
mechanical data mtss001c january 1995 revised february 1999 post office box 655303 ? dallas, texas 75265 pw (r-pdso-g**) plastic small-outline package 14 pins shown 0,65 m 0,10 0,10 0,25 0,50 0,75 0,15 nom gage plane 28 9,80 9,60 24 7,90 7,70 20 16 6,60 6,40 4040064/f 01/97 0,30 6,60 6,20 8 0,19 4,30 4,50 7 0,15 14 a 1 1,20 max 14 5,10 4,90 8 3,10 2,90 a max a min dim pins ** 0,05 4,90 5,10 seating plane 0 8 notes: a. all linear dimensions are in millimeters. b. this drawing is subject to change without notice. c. body dimensions do not include mold flash or protrusion not to exceed 0,15. d. falls within jedec mo-153
important notice texas instruments incorporated and its subsidiaries (ti) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. all products are sold subject to ti?s terms and conditions of sale supplied at the time of order acknowledgment. ti warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with ti?s standard warranty. testing and other quality control techniques are used to the extent ti deems necessary to support this warranty. except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. ti assumes no liability for applications assistance or customer product design. customers are responsible for their products and applications using ti components. to minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. ti does not warrant or represent that any license, either express or implied, is granted under any ti patent right, copyright, mask work right, or other ti intellectual property right relating to any combination, machine, or process in which ti products or services are used. information published by ti regarding third-party products or services does not constitute a license from ti to use such products or services or a warranty or endorsement thereof. use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from ti under the patents or other intellectual property of ti. reproduction of information in ti data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. reproduction of this information with alteration is an unfair and deceptive business practice. ti is not responsible or liable for such altered documentation. resale of ti products or services with statements different from or beyond the parameters stated by ti for that product or service voids all express and any implied warranties for the associated ti product or service and is an unfair and deceptive business practice. ti is not responsible or liable for any such statements. following are urls where you can obtain information on other texas instruments products and application solutions: products applications amplifiers amplifier.ti.com audio www.ti.com/audio data converters dataconverter.ti.com automotive www.ti.com/automotive dsp dsp.ti.com broadband www.ti.com/broadband interface interface.ti.com digital control www.ti.com/digitalcontrol logic logic.ti.com military www.ti.com/military power mgmt power.ti.com optical networking www.ti.com/opticalnetwork microcontrollers microcontroller.ti.com security www.ti.com/security low power wireless www.ti.com/lpw telephony www.ti.com/telephony video & imaging www.ti.com/video wireless www.ti.com/wireless mailing address: texas instruments post office box 655303 dallas, texas 75265 copyright ? 2006, texas instruments incorporated

▲Up To Search▲

Price & Availability of CD74ACT273SM96

	To Download CD74ACT273SM96 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .